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This role partners closely with the CEO to drive alignment, execution, and decision-making across R&D teams. The position focuses on ensuring key initiatives progress effectively by resolving cross-functional gaps and improving organizational clarity.
This role leads global supplier and manufacturing quality for advanced semiconductor and board-level products, partnering with fabs, OSATs and PCB/PCBA suppliers worldwide. It combines deep hands-on quality engineering leadership with advanced data analytics to predict risks, improve yield and scale quality with AI infrastructure growth.
負責電動載具電子系統的整體設計與整合, 帶領團隊完成從架構定義、開發驗證到量產導入的完整流程。 需跨部門與供應商緊密合作,確保產品性能、法規與品質達標。
本職位結合工程專業、廠務管理與數據分析能力,確保製造公用系統穩定、安全且高效運作。 透過IWS / RTT等結構化方法與數據洞察,持續消除損耗、優化能源使用並推動製程改善。
Join a fast-growing semiconductor company developing next-generation post-quantum secure chips for AI and edge computing applications. This role focuses on advanced node physical design, driving full APR flow and leading successful tape-outs at cutting-edge process nodes.
The Mechanical Director will oversee engineering and manufacturing operations within the industry, ensuring high-quality production and operational efficiency. This role is based in Taoyuan City and requires strong leadership and expertise in mechanical processes.
你是否熱衷於製程優化、數據分析,並帶領第一線團隊持續成長? 我們正在尋找一位 Process Lead(製程組長),加入一家國際級FMCG製造企業,一起打造高效且卓越的生產現場。
本職缺專注於高分子材料開發,面向電子載板應用領域。適合具博士學歷的人選,運用深厚材料科學基礎,推動新材料設計、配方優化與製程導入,實現性能與商業化雙重突破。
Lead Taiwan's commercial strategy, customer engagement, and revenue growth initiatives across AI infrastructure, cloud, networking, and ODM ecosystems. Build strategic customer relationships, drive market expansion, and collaborate with global teams to deliver business objectives and growth opportunities.
Drive product engineering from concept to product releaseCollaborate with global teams to deliver gaming innovations
The MD will spearhead the end‑to‑end operating agenda for a diversified conglomerate. The mandate covers portfolio performance, cost leadership, and disciplined growth, with accountability for cross‑border M&A integration, greenfield delivery, and asset optimization. The executive will be the primary catalyst for operating standardization, reliability, and expansion across multiple Asian jurisdictions.
This role leads product, project execution, and cross‑functional alignment for semiconductor packaging technologies. You will manage development programs, drive data‑based decisions, and ensure successful market introduction.
This role leads product engineering activities during mass production for high‑speed semiconductor devices. You will ensure stable, high‑quality manufacturing while supporting yield, test optimization, and on‑time customer delivery across the product lifecycle.
This role leads ATE test strategy and execution for complex mixed-signal SoC products used in high-speed computing and connectivity applications. You will own test development from early silicon to high-volume manufacturing, working closely with design teams and global manufacturing partners.
This role leads manufacturing engineering strategy for a cutting-edge Co-Packaged Optics programme, focusing on automation, scalability, and cost efficiency. You will collaborate cross-functionally to industrialise advanced technologies while driving yield improvement and long-term operational excellence.
負責台灣、美國及全球資料中心建置專案,與美國 Infra Lead密切合作。領導跨部門團隊,管理從設計、施工到系統測試的全流程,並與全球供應商與合作夥伴協作,確保專案如期、高品質完成。
This role leads the development of advanced high‑speed products for datacentre applications, overseeing the full lifecycle from concept to production. You will guide global engineering teams, align cross‑functional stakeholders, and ensure delivery of high‑quality solutions that meet evolving market demands.
This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.
This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.
This role leads factory development, capital project execution, mechanical design review, and commissioning activities. You will ensure engineering quality, construction compliance, and long‑term equipment reliability across the plant.
The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.
This role is responsible for driving revenue growth and strengthening customer relationships across Asia for a fast-growing Connectivity & Storage business unit. The ideal candidate will have 10-15 years of experience managing complex customer engagements and revenue targets in a technology-driven organization.
此職位負責新竹大型工程專案之工地 HSE 全面管理,從專案初期到完工,主導健康、安全、環境與保全相關策略與落地執行。角色需在業主、工程團隊與多家承包商之間,建立一致且高標準的安全文化,確保高風險建廠專案零事故推進。
This role focuses on developing next-generation liquid filtration products for semiconductor wet process applications. The successful candidate will lead NPD projects from concept through commercialisation, using DOE and statistical analysis to drive performance improvements.
此職位負責台灣地區半導體關鍵供應商的全生命週期品質管理,涵蓋供應商准入、稽核、異常處理與持續改善。 將與晶圓廠及供應商密切合作,確保 Fab 製程相關產品與材料品質穩定並符合出貨要求。
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