Manufacturing jobs in Taiwan

本職位結合工程專業、廠務管理與數據分析能力，確保製造公用系統穩定、安全且高效運作。
透過IWS / RTT等結構化方法與數據洞察，持續消除損耗、優化能源使用並推動製程改善。

此職位負責端到端伺服器產品 NPI 專案，從專案啟動到量產與後續維運。

你將在高度變動的環境中，協調跨部門與客戶，確保專案如期、如質、如預算交付。

Support mechanical design across NPI, RFQ, and platform projects

Deliver cost‑effective, reliable designs meeting customer needs

• This role provides customer-facing quality and technical support within a semiconductor manufacturing environment.
  You will apply data-driven quality tools, collaborate cross-functionally, and drive continuous improvement to enhance product reliability and customer satisfaction.
  

• This role focuses on driving business growth by delivering tailored process-cleaning solutions to electronics manufacturing customers. You will act as a trusted technical advisor, supporting clients from problem analysis through solution implementation while developing long-term partnerships.

你是否熱衷於製程優化、數據分析，並帶領第一線團隊持續成長？
我們正在尋找一位 Process Lead（製程組長），加入一家國際級FMCG製造企業，一起打造高效且卓越的生產現場。

此職位負責資安產品的完整生命週期，從市場需求定義到產品上市策略制定與執行。需與業務、工程及合作夥伴緊密合作，推出具競爭力的資安解決方案。

本職位負責AI Server與GPU Server平台的整體系統架構設計，涵蓋compute、network、power與cooling整合。你將與國際CSP/Hyperscaler客戶合作，打造高功耗、高密度AI基礎設施解決方案並推動新技術落地。

This role leads the Generic and AI Server project management. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

This role supports customer new product design-in activities through application engineering expertise while driving design wins and business growth. The position bridges customers, sales, and internal teams to deliver effective technical solutions.

This role leads global supplier and manufacturing quality for advanced semiconductor and board-level products, partnering with fabs, OSATs and PCB/PCBA suppliers worldwide. It combines deep hands-on quality engineering leadership with advanced data analytics to predict risks, improve yield and scale quality with AI infrastructure growth.

This role leads the design, validation, and delivery of Generic and AI Server hardware, owning critical technical decisions while ensuring quality, cost, and schedule targets are met. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

• 本職位負責高精密光學系統的整體規劃與研發，涵蓋照明、成像與感測技術。您將帶領團隊從概念開發至產品量產，並確保技術與市場需求高度契合。

• We are seeking an experienced and forward‑thinking engineering leader to drive the development of next‑generation LiDAR modules. This role offers the opportunity to shape core product architecture, lead a skilled technical team, and deliver breakthrough innovations in sensing hardware.
  

我們的客戶為全球知名電子製造與科技服務企業，長期深耕NB與相關硬體產品領域，於國際市場具備高度市佔與穩健布局。公司擁有完善的研發體系與成熟的工程團隊，持續推動產品創新與技術升級，為國際品牌客戶提供高品質解決方案。

The Mechanical Director will oversee engineering and manufacturing operations within the industry, ensuring high-quality production and operational efficiency. This role is based in Taoyuan City and requires strong leadership and expertise in mechanical processes.

This role leads manufacturing engineering strategy for a cutting-edge Co-Packaged Optics programme, focusing on automation, scalability, and cost efficiency. You will collaborate cross-functionally to industrialise advanced technologies while driving yield improvement and long-term operational excellence.

Design and deliver high‑quality fitness products through a design‑build‑test development culture.

You will collaborate across functions to translate user needs into reliable, scalable electromechanical solutions.

This role leads the development of advanced high‑speed products for datacentre applications, overseeing the full lifecycle from concept to production. You will guide global engineering teams, align cross‑functional stakeholders, and ensure delivery of high‑quality solutions that meet evolving market demands.

This role leads product engineering activities during mass production for high‑speed semiconductor devices. You will ensure stable, high‑quality manufacturing while supporting yield, test optimization, and on‑time customer delivery across the product lifecycle.

This role leads ATE test strategy and execution for complex mixed-signal SoC products used in high-speed computing and connectivity applications. You will own test development from early silicon to high-volume manufacturing, working closely with design teams and global manufacturing partners.

This role owns end‑to‑end hardware development for high‑power server power supplies.

You will lead circuit design, validation, and cross‑functional collaboration.

This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.

The MD will spearhead the end‑to‑end operating agenda for a diversified conglomerate. The mandate covers portfolio performance, cost leadership, and disciplined growth, with accountability for cross‑border M&A integration, greenfield delivery, and asset optimization. The executive will be the primary catalyst for operating standardization, reliability, and expansion across multiple Asian jurisdictions.

This role leads product, project execution, and cross‑functional alignment for semiconductor packaging technologies. You will manage development programs, drive data‑based decisions, and ensure successful market introduction.

Lead technical engagement with data centre customers, focusing on air and liquid cooling systems. This role combines thermal engineering expertise with customer-facing responsibilities to deliver high-efficiency cooling solutions for AI-driven workloads and high-density racks.

Leads hardware development of BBU power systems for servers and data centre applications.

You will manage teams, define architectures, and drive products to mass production.

This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.

這是一個結合 Android 系統、SoC 平台與硬體互動的測試工程角色，能實際參與晶片效能、功耗與系統穩定度驗證。

你將與資深工程團隊合作，深入參與高效能處理器與行動平台的關鍵測試專案。

主要負責癌症基因檢測的臨床NGS生物資訊分析流程之執行與維護。你將與跨部門合作，確保分析結果的準確性、符合法規要求，並維持產線穩定運作。