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This role leads the development of advanced high‑speed products for datacentre applications, overseeing the full lifecycle from concept to production. You will guide global engineering teams, align cross‑functional stakeholders, and ensure delivery of high‑quality solutions that meet evolving market demands.
This role owns end‑to‑end hardware development for high‑power server power supplies.You will lead circuit design, validation, and cross‑functional collaboration.
This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.
Leads hardware development of BBU power systems for servers and data centre applications.You will manage teams, define architectures, and drive products to mass production.
This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.
Leads advanced structural and thermal FEA for complex systems.You will act as a subject matter expert guiding design and reliability decisions.
Leads global technology integration and technical support strategy across complex visual and collaboration solutions.You will define scalable architectures, empower technical teams, and elevate customer and partner experience worldwide.
This role provides engineering expertise to design, develop, and enhance semiconductor test sockets and related fixtures to meet customer and quality requirements. You will work closely with cross‑functional teams to deliver robust, high‑performance products that support business growth and customer satisfaction.
The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.
This role focuses on developing next-generation liquid filtration products for semiconductor wet process applications. The successful candidate will lead NPD projects from concept through commercialisation, using DOE and statistical analysis to drive performance improvements.
Drive board‑level SI/PI analysis and simulation for high‑speed consumer hardware, ensuring robust performance across complex PCB and system architectures. You'll work closely with development teams to identify design risks early, optimize interconnects and PDN, and translate simulation insights into concrete design improvements.
Technologist based in Hsinchu City, focusing on advanced process technologies, yield optimisation, and cross-functional collaboration with global teams to support product development and high-volume manufacturing.
We are seeking an experienced and visionary Analog Design Manager to lead a high-performing team of over 10 analog/mixed-signal engineers. This role is pivotal in driving innovation and execution across multiple domains including signal chain, power, and SerDes.
This role focuses on the design and development of analog/mixed-signal ICs for power management applications, including DC/DC converters, LDOs, and charge pumps. The engineer will lead circuit-level design, verification, and evaluation, working cross-functionally to bring high-performance products from concept to production.
此職位負責電源供應系統的韌體架構設計、開發與系統整合,並主導整體韌體開發生命週期。角色同時具備技術領導與跨部門協作責任,確保產品在效能、可靠度與安全性上達到國際水準。
此職位負責商用網通產品的 Linux BSP、Bootloader 與韌體開發,涵蓋多平台 bring-up 與底層系統整合。將與硬體、網通、Wi‑Fi、雲端及製造等團隊密切合作,解決產品量產前後的關鍵平台問題。
知名外商公司在台灣創立R&D團隊,專注於次世代消費性電子產品(穿戴式 + 行動裝置)結合領先業界的磁性材料技術,開發超薄、高效能微型風扇模組化解決方案。
此職位負責mid-board光收發模組的嵌入式韌體架構、開發與系統整合。你將確保模組在效能、可靠度、標準合規與系統互通性上的卓越表現,並橫跨產品全生命週期。
此職位負責台灣地區半導體關鍵供應商的全生命週期品質管理,涵蓋供應商准入、稽核、異常處理與持續改善。 將與晶圓廠及供應商密切合作,確保 Fab 製程相關產品與材料品質穩定並符合出貨要求。
此職位負責規劃並領導網路交換器 BSP 與 Linux Kernel/Driver 的整體開發流程,從底層驅動到系統穩定度全面掌握。將與產品與專案團隊緊密合作,確保系統效能、可靠度與量產交付品質,同時負責團隊管理與技術決策。
電機工程團隊的重要支援角色,負責原型製作、焊接與樣品 rework,協助工程團隊快速驗證產品設計。你將在實驗室環境中,扮演設計與實體實作之間的關鍵橋樑。
此職位負責企業級 Access Point(AP)系統的核心模組整合、效能優化與系統層問題分析。你將橫跨 Wi‑Fi、Linux networking、雲端控制器與驅動層,打造高穩定、高效能的無線平台。
此職位負責機器人軟硬體整合,從行為開發、機電設計到系統驗證都能完整參與。你將在實驗環境中與資深工程師協作,快速迭代並提升機器人整體效能。
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