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This role is a hardware application engineering position focused on supporting complex data centre solutions. You will collaborate with internal teams and customers to enable successful product integration, from design to deployment and beyond. The position combines deep technical expertise with cross-functional leadership.
This role focuses on driving demand creation and providing advanced technical support for digital power solutions. You will act as a key interface between customers, sales teams, and internal engineering groups, influencing design decisions and enabling successful product adoption.
This role leads global server hardware strategy, development, and delivery for a fast‑growing enterprise infrastructure business. You will drive platform innovation, manage global teams, and partner closely with customers and suppliers.
This role is for a expert-level power module design engineer responsible for end‑to‑end development of high‑performance power module products. You will drive technical innovation, collaborate globally, and influence product direction from concept through production.
此職位負責 AIoT、安防或網通產品之機構設計,從概念階段一路推進至量產。您將與跨部門團隊及全球合作夥伴緊密合作,打造高品質且具成本競爭力的產品。
This role leads the Generic and AI Server project management. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.
This role leads the design, validation, and delivery of Generic and AI Server hardware, owning critical technical decisions while ensuring quality, cost, and schedule targets are met. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.
This role is responsible for driving and improving the Quality Management System and product quality architecture for optical fibre solutions. You will lead root cause analysis, implement corrective actions, and ensure quality standards throughout new product introduction and production.
Drive product engineering from concept to product releaseCollaborate with global teams to deliver gaming innovations
This role focuses on onsite quality verification, failure analysis, and technical support for embedded power products at customer sites in Taipei. It combines hands-on testing, cross-functional coordination, and customer relationship management to improve product quality and response efficiency.
This role leads a team of customer quality engineers to ensure product reliability, resolve quality issues, and enhance customer satisfaction for strategic accounts. It combines team leadership, project management, and customer engagement to drive continuous improvement and business performance.
此職位負責端到端伺服器產品 NPI 專案,從專案啟動到量產與後續維運。你將在高度變動的環境中,協調跨部門與客戶,確保專案如期、如質、如預算交付。
Support mechanical design across NPI, RFQ, and platform projectsDeliver cost‑effective, reliable designs meeting customer needs
This is a critical customer-facing technical role combining application engineering and field support.You will work closely with leading-edge clients in semiconductor and precision automation, driving system performance and innovation.
此職位負責 AIoT、安防或網通產品之機構設計,從概念階段一路推進至量產。 您將與跨部門團隊及全球合作夥伴緊密合作,打造高品質且具成本競爭力的產品。
This role leads product engineering activities during mass production for high‑speed semiconductor devices. You will ensure stable, high‑quality manufacturing while supporting yield, test optimization, and on‑time customer delivery across the product lifecycle.
This role leads ATE test strategy and execution for complex mixed-signal SoC products used in high-speed computing and connectivity applications. You will own test development from early silicon to high-volume manufacturing, working closely with design teams and global manufacturing partners.
Lead technical engagement with data centre customers, focusing on air and liquid cooling systems. This role combines thermal engineering expertise with customer-facing responsibilities to deliver high-efficiency cooling solutions for AI-driven workloads and high-density racks.
Join a fast-growing semiconductor company developing next-generation post-quantum secure chips for AI and edge computing applications. This role focuses on advanced node physical design, driving full APR flow and leading successful tape-outs at cutting-edge process nodes.
This role leads manufacturing engineering strategy for a cutting-edge Co-Packaged Optics programme, focusing on automation, scalability, and cost efficiency. You will collaborate cross-functionally to industrialise advanced technologies while driving yield improvement and long-term operational excellence.
This role leads the development of advanced high‑speed products for datacentre applications, overseeing the full lifecycle from concept to production. You will guide global engineering teams, align cross‑functional stakeholders, and ensure delivery of high‑quality solutions that meet evolving market demands.
This role owns end‑to‑end hardware development for high‑power server power supplies.You will lead circuit design, validation, and cross‑functional collaboration.
This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.
The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.
The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.
本職位負責AI Server與GPU Server平台的整體系統架構設計,涵蓋compute、network、power與cooling整合。你將與國際CSP/Hyperscaler客戶合作,打造高功耗、高密度AI基礎設施解決方案並推動新技術落地。
此職位負責領導產品開發部門,從策略規劃到量產導入,全程掌控新品開發品質、時程與成本。需整合跨部門資源並推動創新與專利佈局,支撐企業全球擴張。
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