Engineering Manufacturing jobs in Taipei City

This role leads global server hardware strategy, development, and delivery for a fast‑growing enterprise infrastructure business. You will drive platform innovation, manage global teams, and partner closely with customers and suppliers.

This role leads the design, validation, and delivery of Generic and AI Server hardware, owning critical technical decisions while ensuring quality, cost, and schedule targets are met. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

• We are seeking an experienced and forward‑thinking engineering leader to drive the development of next‑generation LiDAR modules. This role offers the opportunity to shape core product architecture, lead a skilled technical team, and deliver breakthrough innovations in sensing hardware.
  

This role leads the quality function for the Power & System business unit, driving new quality technologies, TQM enhancement, and continuous customer satisfaction improvement. It also oversees team management and partners closely with R&D on DQE and engineering quality, which accounts for around 50% of the role.

• This role leads mechanical design and cross‑functional coordination for advanced consumer electronics products while ensuring technical, customer, and project requirements are fully met. You will work closely with global clients and internal engineering teams to drive product excellence from concept to mass production.
  

This role leads product engineering activities during mass production for high‑speed semiconductor devices. You will ensure stable, high‑quality manufacturing while supporting yield, test optimization, and on‑time customer delivery across the product lifecycle.

This role leads ATE test strategy and execution for complex mixed-signal SoC products used in high-speed computing and connectivity applications. You will own test development from early silicon to high-volume manufacturing, working closely with design teams and global manufacturing partners.

Lead technical engagement with data centre customers, focusing on air and liquid cooling systems. This role combines thermal engineering expertise with customer-facing responsibilities to deliver high-efficiency cooling solutions for AI-driven workloads and high-density racks.

The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.

You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.

The position of Hardware R&D Manager focuses on leading and overseeing hardware development projects within the technology and telecoms industry. This role is based in New Taipei City and requires expertise in hardware engineering and team management.

This role focuses on developing and optimizing low‑level software-including kernel, drivers, BSP, and system services-for next‑generation VR headset platforms. You will lead hardware bring‑up, system integration, and performance tuning across a complex multi‑team environment.

負責領導硬體研發團隊，從新產品開發、現有平台優化到跨部門協作，確保類比相關電路設計具備卓越品質與市場競爭力。此職位同時需要深入理解客戶需求，以技術決策驅動創新並提升團隊整體能力。

The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.

此職位負責資料中心、AI Server 與標準機架式伺服器的平台產品策略與產品藍圖，確保市場競爭力與長期業務成長。角色需高度跨部門協作能力，並能與客戶、供應鏈與生態系夥伴緊密合作，推動產品成功落地。

負責台灣、美國及全球資料中心建置專案，與美國 Infra Lead密切合作。領導跨部門團隊，管理從設計、施工到系統測試的全流程，並與全球供應商與合作夥伴協作，確保專案如期、高品質完成。

主導從概念設計到量產的整體產品開發，融合機械工程與工業設計，打造具備結構穩定性、美學一致性與食品安全合規的創新機器人產品。

• 此職位負責桃園廠區之環境、安全與職業衛生管理，帶領團隊確保營運符合在地法規與企業全球標準，並持續優化ISO體系運作。
• 角色需結合人員管理、專案推動與跨國溝通能力，強化廠區風險控管與安全文化落實。

此職位負責 SoC 整合、數位邏輯設計、IP 整合與 FPGA/ASIC 驗證，並主導從前期架構到 Tape‑out 的完整流程。您將與跨部門工程團隊合作，打造高效能與高安全性的先進晶片解決方案。

此職位負責機器人軟硬體整合，從行為開發、機電設計到系統驗證都能完整參與。你將在實驗環境中與資深工程師協作，快速迭代並提升機器人整體效能。