Electronics jobs in Taiwan

負責電動載具電子系統的整體設計與整合， 帶領團隊完成從架構定義、開發驗證到量產導入的完整流程。 需跨部門與供應商緊密合作，確保產品性能、法規與品質達標。

Reporting into the engineering leadership team, the Principal OCXO Design Engineer will be responsible for architecting and developing high-performance Oven Controlled Crystal Oscillator (OCXO) products for mission-critical applications.

This role is responsible for end-to-end management of the overseas keyboard business, including strategy, operations, and revenue growth. The BU General Manager will lead customer development efforts while ensuring strong execution across supply chain, sales, and delivery.

As a key member of the plant leadership team, this individual will partner closely with operations, engineering, product and supply-chain stakeholders. The position will provide financial and commercial insight to improve cost competitiveness, operational performance, investment decisions and long-term value creation.

This role leads the global sales, channel development, and go‑to‑market execution for the company's own‑brand consumer charging products across multiple international regions. It carries full commercial ownership, including revenue growth, marketplace expansion, distributor performance, and leadership of a regional sales & marketing team.

Our client seeks an seasoned General Manager to lead its Taiwan operations, driving strategic expansion, operational excellence, and global business alignment. The role oversees full P&L, commercial development, and cross‑functional leadership in a technology-driven manufacturing environment. Experience in both OBM & ODM especially in consumer electronics is strong plus!

負責統籌集團整體財務與會計管理，涵蓋財務報告、海外子公司、資金調度、稅務規劃及內部控制，確保各項財務資訊正確、合規且能有效支持營運。

此職位將與集團高階管理團隊密切合作，透過財務分析、風險管理及制度優化，協助公司提升營運透明度並支持海外業務的長期發展。

• 此職位聚焦於記憶體產品（DRAM 模組 或 NAND/SSD 解決方案）的開發、驗證與量產導入，涵蓋產品規格定義、測試驗證、不良分析與跨部門協作。
• 您將與內外部夥伴密切合作，確保產品在效能、可靠度與相容性上的競爭力，並支援客戶與市場端的技術需求。

This role leads the development and optimization of thermal solutions for advanced electronic products, including AEC transceivers and liquid cooling systems. You will drive design decisions through simulation, validation, and cross-functional leadership while mentoring engineers.

We are seeking an experienced Package Design Engineer to lead the development of advanced package solutions for high-performance products. This role involves close collaboration with design, manufacturing, and customer teams to ensure package designs meet electrical, thermal, mechanical, reliability, and production requirements.

• We are seeking a Senior/Staff System Validation Engineer to support the validation and deployment of advanced optical products. This role combines system validation, automation development, customer support, and cross-functional collaboration to ensure product quality and successful customer adoption.

此職務聚焦於資料中心高速交換機硬體設計，涵蓋800G與51.2T平台，從系統架構到量產皆全程參與。
您將與SI/PI、Power與Thermal等團隊合作，主導高速訊號與電源整合設計及除錯。

The Technical Application Manager will oversee the implementation and optimization of technical applications within the industrial and manufacturing industry. This role focuses on ensuring seamless integration of technical solutions to meet operational and business needs.

This role focuses on deploying AI-driven solutions into real-world chip design workflows. You will bridge advanced AI technologies with semiconductor engineering, translating complex challenges into practical, scalable solutions. It combines technical depth, customer engagement, and fast-paced prototyping.

This role leads the development of advanced thermal solutions for high-performance electronic products, including air and liquid cooling systems. You will shape product architecture through deep thermal expertise while collaborating with global cross-functional teams.

This role leads a Taiwan-based IC design centre, combining technical leadership with active participation in analog and mixed‑signal IC design. The position focuses on signal chain development, including ADC, DAC, and amplifier architectures, while driving innovation from concept through silicon validation.

This role is for a expert-level power module design engineer responsible for end‑to‑end development of high‑performance power module products. You will drive technical innovation, collaborate globally, and influence product direction from concept through production.

This role leads the Generic and AI Server project management. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

This role supports customer new product design-in activities through application engineering expertise while driving design wins and business growth. The position bridges customers, sales, and internal teams to deliver effective technical solutions.

This role leads the design, validation, and delivery of Generic and AI Server hardware, owning critical technical decisions while ensuring quality, cost, and schedule targets are met. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

• We are seeking an experienced and forward‑thinking engineering leader to drive the development of next‑generation LiDAR modules. This role offers the opportunity to shape core product architecture, lead a skilled technical team, and deliver breakthrough innovations in sensing hardware.
  

This Design Engineer role focuses on developing innovative connector solutions for high-growth industries such as data centers and semiconductors. You will collaborate with global teams to transform customer requirements into manufacturable, high-quality product concepts.

負責電子產品原型製作、焊接修改與實驗室技術支援，是研發團隊將設計快速轉化為實體產品的重要橋樑。
與硬體工程師密切合作，協助產品開發、測試驗證及樣品管理。

The Sales Director will lead strategic sales initiatives across major key accounts, including TK3C (燦坤), E-Life (全國電子), Carrefour (C4), PX Mart, and Costco. This leadership role is responsible for driving revenue growth, building high-performing teams, and establishing long-term partnerships with key retailers.

此角色將負責先進自動化產線導入與設備整合，參與高階電子產品的量產專案。
適合願意投入高強度專案、追求快速成長與高回報的工程師。

本職缺專注於高分子材料開發，面向電子載板應用領域。適合具博士學歷的人選，運用深厚材料科學基礎，推動新材料設計、配方優化與製程導入，實現性能與商業化雙重突破。