Engineering jobs in Taiwan

Leads the Engineering organization across Asia-Pacific, overseeing customer design‑ins, technical debugging, validation, and high‑speed connectivity platform integration. It serves as the primary technical bridge between global customers and engineering teams, influencing product roadmaps for next‑generation optical and data‑center interconnect solutions.

This is an exciting opportunity for a CTO / Head of Engineering to lead technological innovation and drive engineering excellence in the insurance industry. The role is focused on overseeing the development of advanced solutions and ensuring the seamless integration of cutting-edge technology.

We are seeking a Cybersecurity Engineer with approximately 5 years of experience to join our security team. In this role, you will gain hands-on exposure across security operations, contribute to security architecture, and support developers and IT teams with security best practices.

This role leads ATE test strategy and execution for complex mixed-signal SoC products used in high-speed computing and connectivity applications. You will own test development from early silicon to high-volume manufacturing, working closely with design teams and global manufacturing partners.

此職位主要負責 PCB 測試治具的設計與開發與Lay out，支援電子硬體在機構與電性層面的驗證需求。你將與多個工程團隊密切合作，確保設計品質、可製造性與文件完整性。

此職位負責機器人軟硬體整合，從行為開發、機電設計到系統驗證都能完整參與。你將在實驗環境中與資深工程師協作，快速迭代並提升機器人整體效能。

此職位負責企業級 Access Point（AP）系統的核心模組整合、效能優化與系統層問題分析。

你將橫跨 Wi‑Fi、Linux networking、雲端控制器與驅動層，打造高穩定、高效能的無線平台。

AI x Security 是目前全球大廠爭相招攬的核心戰力，而我們正將這份前瞻挑戰帶入台灣。這是一個領先台灣市場、與國際技術接軌的職位，建構 AI 應用的全球安全準則。（只接受 AI Engineer 背景人選）

This role provides strategic and operational leadership across engineering and machine development, overseeing the conception, development, and deployment of advanced manufacturing technologies and equipment. The position is critical to enabling long term growth, competitiveness, and operational sustainability within a highly regulated environment.

此職位負責 SoC 整合、數位邏輯設計、IP 整合與 FPGA/ASIC 驗證，並主導從前期架構到 Tape‑out 的完整流程。您將與跨部門工程團隊合作，打造高效能與高安全性的先進晶片解決方案。

我們正在尋找一位 AI 工程師，負責運用 LLM 與 RAG 框架，開發能支撐企業營運的智慧應用。

主導跨系統 ETL 架構與供應鏈 Data Warehouse 的開發實作，並深度參與從多源資料清洗、ETL 管線建置到 BI 決策支援的全流程。

• 負責中大型系統整合與 Cloud Architecture 設計
• 規劃並執行 AI 系統的上線流程、與 IT 團隊協作解決系統串接中的技術難題

在世界級的舞台，定義 AI 在金融領域的未來應用。
我們正在尋找一位具備 8 年以上實戰經驗的技術人才，主導從 LLM 集成到 MLOps 自動化部署的核心開發。

這是一份讓你結合 Data Engineering 與 AI 數據準備 的核心職缺。
你將運用 Python、SQL、Airflow、雲端與容器化技術，打造新一代數據平台與治理機制。

The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.

You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.

This role leads global server hardware strategy, development, and delivery for a fast‑growing enterprise infrastructure business. You will drive platform innovation, manage global teams, and partner closely with customers and suppliers.

This role focuses on developing next-generation liquid filtration products for semiconductor wet process applications. The successful candidate will lead NPD projects from concept through commercialisation, using DOE and statistical analysis to drive performance improvements.

This role leads the design, validation, and delivery of Generic and AI Server hardware, owning critical technical decisions while ensuring quality, cost, and schedule targets are met. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

• We are seeking an experienced and forward‑thinking engineering leader to drive the development of next‑generation LiDAR modules. This role offers the opportunity to shape core product architecture, lead a skilled technical team, and deliver breakthrough innovations in sensing hardware.
  

This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.

This role leads product engineering activities during mass production for high‑speed semiconductor devices. You will ensure stable, high‑quality manufacturing while supporting yield, test optimization, and on‑time customer delivery across the product lifecycle.

The position of Hardware R&D Manager focuses on leading and overseeing hardware development projects within the technology and telecoms industry. This role is based in New Taipei City and requires expertise in hardware engineering and team management.

Drive board‑level SI/PI analysis and simulation for high‑speed consumer hardware, ensuring robust performance across complex PCB and system architectures. You'll work closely with development teams to identify design risks early, optimize interconnects and PDN, and translate simulation insights into concrete design improvements.

Lead technical engagement with data centre customers, focusing on air and liquid cooling systems. This role combines thermal engineering expertise with customer-facing responsibilities to deliver high-efficiency cooling solutions for AI-driven workloads and high-density racks.

We are expanding our Analog / Mixed-Signal IP Engineering team and are hiring experienced Analog Design Engineers across multiple technical specialties. Depending on expertise, candidates will contribute from architecture definition through tape-out and silicon bring-up. Work location is flexible: Taiwan or Penang, Malaysia.

• This role leads mechanical design and cross‑functional coordination for advanced consumer electronics products while ensuring technical, customer, and project requirements are fully met. You will work closely with global clients and internal engineering teams to drive product excellence from concept to mass production.
  

Design and deliver high‑quality fitness products through a design‑build‑test development culture.

You will collaborate across functions to translate user needs into reliable, scalable electromechanical solutions.

This role leads the technology strategy and execution for a newly established OSAT fab, overseeing facility construction, packaging and test technology deployment, and R&D direction. Reporting to the CEO, the CTO will build world‑class engineering capabilities while driving innovation, reliability, and scalable manufacturing excellence.

This role focuses on developing and optimizing low‑level software-including kernel, drivers, BSP, and system services-for next‑generation VR headset platforms. You will lead hardware bring‑up, system integration, and performance tuning across a complex multi‑team environment.