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This role is responsible for leading Backplane product development, NPI project execution, and customer-facing technical activities. The successful candidate will drive high-speed interconnect solutions from concept design through production while collaborating closely with global customers and cross-functional teams.
This is a strategic leadership role responsible for building and leading a global engineering team focused on next-generation memory connector solutions. The position combines technical leadership, product development, customer engagement, and organizational growth to support emerging AI, cloud, server, and high-performance computing platforms.
This role leads manufacturing engineering strategy for a cutting-edge Co-Packaged Optics programme, focusing on automation, scalability, and cost efficiency. You will collaborate cross-functionally to industrialise advanced technologies while driving yield improvement and long-term operational excellence.
Join a global technology leader as an Electrical Engineering Manager, driving the development of high-speed internal cable and integrated connector solutions for AI, server, networking, and data center applications. You will lead a team of engineers while owning the complete electronic design process from concept through production.
We are seeking an experienced Application Leader to drive application development and market adoption for advanced electronics materials of substrate materials. This role will lead a geographically diverse team, collaborate with customers and industry partners worldwide, and translate market needs into commercially successful solutions and technology roadmaps.
我們正在尋找一位資深技術專案經理(Senior TPM),負責推動多項半導體產品開發計畫,確保跨部門團隊依時程完成各階段目標。此職務將與工程團隊及高階管理層密切合作,管理專案進度、風險、資源與關鍵交付成果。
負責台灣、美國及全球資料中心建置專案,與美國 Infra Lead密切合作。領導跨部門團隊,管理從設計、施工到系統測試的全流程,並與全球供應商與合作夥伴協作,確保專案如期、高品質完成。
This role leads cross-functional programmes that support product development, customer projects, and business growth within the semiconductor industry. The successful candidate will drive planning, execution, stakeholder alignment, and risk management to ensure successful project delivery.
This role leads product, project execution, and cross‑functional alignment for semiconductor packaging technologies. You will manage development programs, drive data‑based decisions, and ensure successful market introduction.
We are seeking a seasoned Program Management Leader to oversee the development and delivery of consumer technology products for global markets. This position offers the opportunity to lead a team of programme managers while driving cross-functional execution from concept development through mass production.
Lead commercial strategy and drive revenue growth through distributor management and key account development, with a focus on analytical instrument solutions. Own industrial segment expansion (including semiconductor), while aligning cross-functional teams and executing go-to-market plans in Taiwan.
Drive strategic growth with leading OEM/ODM customers across the AI server, data center, and enterprise hardware ecosystem. This role combines account development, design-in engagement, and cross-functional collaboration to grow key customer relationships and capture new business opportunities.
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