工程設計、研發及新產品導入職務

• This role focuses on developing and validating test solutions for power IC products. You will collaborate with cross-functional teams to ensure smooth product introduction and continuous improvement throughout the production cycle. The position involves both technical execution and analytical problem-solving.

This role partners closely with the CEO to drive alignment, execution, and decision-making across R&D teams. The position focuses on ensuring key initiatives progress effectively by resolving cross-functional gaps and improving organizational clarity.

此職位負責NB BIOS進階技術開發與疑難問題解決。角色以技術深耕為主，並需在必要時與客戶溝通專案進度與技術議題。

Join a fast-growing semiconductor company developing next-generation post-quantum secure chips for AI and edge computing applications.
This role focuses on advanced node physical design, driving full APR flow and leading successful tape-outs at cutting-edge process nodes.

Drive product engineering from concept to product release

Collaborate with global teams to deliver gaming innovations

This role leads manufacturing engineering strategy for a cutting-edge Co-Packaged Optics programme, focusing on automation, scalability, and cost efficiency. You will collaborate cross-functionally to industrialise advanced technologies while driving yield improvement and long-term operational excellence.

This role leads the development of advanced high‑speed products for datacentre applications, overseeing the full lifecycle from concept to production. You will guide global engineering teams, align cross‑functional stakeholders, and ensure delivery of high‑quality solutions that meet evolving market demands.

This role owns end‑to‑end hardware development for high‑power server power supplies.

You will lead circuit design, validation, and cross‑functional collaboration.

This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.

Leads hardware development of BBU power systems for servers and data centre applications.

You will manage teams, define architectures, and drive products to mass production.

This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.

The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.

You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.

This role focuses on developing next-generation liquid filtration products for semiconductor wet process applications. The successful candidate will lead NPD projects from concept through commercialisation, using DOE and statistical analysis to drive performance improvements.

Technologist based in Hsinchu City, focusing on advanced process technologies, yield optimisation, and cross-functional collaboration with global teams to support product development and high-volume manufacturing.

We are seeking an experienced and visionary Analog Design Manager to lead a high-performing team of over 10 analog/mixed-signal engineers. This role is pivotal in driving innovation and execution across multiple domains including signal chain, power, and SerDes.

This role focuses on the design and development of analog/mixed-signal ICs for power management applications, including DC/DC converters, LDOs, and charge pumps. The engineer will lead circuit-level design, verification, and evaluation, working cross-functionally to bring high-performance products from concept to production.

本職缺專注於高分子材料開發，面向電子載板應用領域。適合具博士學歷的人選，運用深厚材料科學基礎，推動新材料設計、配方優化與製程導入，實現性能與商業化雙重突破。

• 本職位負責高精密光學系統的整體規劃與研發，涵蓋照明、成像與感測技術。您將帶領團隊從概念開發至產品量產，並確保技術與市場需求高度契合。

我們的客戶為全球知名電子製造與科技服務企業，長期深耕NB與相關硬體產品領域，於國際市場具備高度市佔與穩健布局。公司擁有完善的研發體系與成熟的工程團隊，持續推動產品創新與技術升級，為國際品牌客戶提供高品質解決方案。

此職位專注於伺服器診斷軟體與自動化工具開發，支援 Server 平台從設計驗證到量產階段。

角色偏向研發與系統開發，適合具備 Server 背景、喜歡動手寫程式並解決系統問題的人才。

知名外商公司在台灣創立R&D團隊，專注於次世代消費性電子產品（穿戴式 + 行動裝置）

結合領先業界的磁性材料技術，開發超薄、高效能微型風扇模組化解決方案。

此職位負責mid-board光收發模組的嵌入式韌體架構、開發與系統整合。你將確保模組在效能、可靠度、標準合規與系統互通性上的卓越表現，並橫跨產品全生命週期。

此職位負責台灣地區半導體關鍵供應商的全生命週期品質管理，涵蓋供應商准入、稽核、異常處理與持續改善。
將與晶圓廠及供應商密切合作，確保 Fab 製程相關產品與材料品質穩定並符合出貨要求。

此職位負責規劃並領導網路交換器 BSP 與 Linux Kernel/Driver 的整體開發流程，從底層驅動到系統穩定度全面掌握。

將與產品與專案團隊緊密合作，確保系統效能、可靠度與量產交付品質，同時負責團隊管理與技術決策。

電機工程團隊的重要支援角色，負責原型製作、焊接與樣品 rework，協助工程團隊快速驗證產品設計。你將在實驗室環境中，扮演設計與實體實作之間的關鍵橋樑。

此職位負責企業級 Access Point（AP）系統的核心模組整合、效能優化與系統層問題分析。

你將橫跨 Wi‑Fi、Linux networking、雲端控制器與驅動層，打造高穩定、高效能的無線平台。