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Engineering Manager - Memory Solutions

台灣 全職 查看職務說明
This is a strategic leadership role responsible for building and leading a global engineering team focused on next-generation memory connector solutions. The position combines technical leadership, product development, customer engagement, and organizational growth to support emerging AI, cloud, server, and high-performance computing platforms.
  • * Lead the creation of a global memory connector engineering organization
  • * Drive next-generation AI, server, and HPC memory connectivity innovation

關於我們的客戶

Our client is a global technology leader specializing in advanced interconnect and electronic solutions serving data center, cloud computing, networking, and industrial markets. The company is investing heavily in next-generation memory technologies and expanding its engineering capabilities to support future computing architectures.

職務說明

* Build, mentor, and lead a high-performing global engineering team focused on memory connectivity products.

* Define and execute technology roadmaps for DDR5, DDR6, DIMM, SODIMM, SOCAMM, and future memory architectures.

* Lead the full product development lifecycle from concept and design through validation, qualification, and production launch.

* Partner with customers and industry ecosystem stakeholders to develop differentiated next-generation solutions.

* Drive engineering excellence across performance, cost, manufacturability, quality, and program execution.

理想的應徵者

You are an experienced engineering leader with a strong background in connectors, interconnect technologies, semiconductor hardware, server platforms, or related electronics industries. You bring a proven track record of leading complex product development programs, managing global teams, engaging with customers at a technical level, and balancing innovation with commercial and manufacturing realities. Experience in memory connectors, high-speed signal integrity, AI infrastructure, or large-scale electronics manufacturing environments would be highly advantageous.

福利待遇

* Opportunity to shape a new global engineering capability within a market-leading technology organization

* High visibility role working with global customers and next-generation AI and data center platforms

* Significant career growth potential with broad international leadership exposure

聯絡
Shaw Hsiao
職務編號
JN-092026-7097069
手機號
+886287298228

職務概要

職務類別
工程與製造
子類別
工程設計、研發及新產品導入
產業
資訊科技/通訊
地區
台灣
合約類型
全職
招募顧問名稱
Shaw Hsiao
招募顧問電話
+886287298228
職務編號
JN-092026-7097069

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