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Liquid Cooling RD Head

新北市 全職 查看職務說明
We are seeking an experienced R&D Head to lead the development of advanced liquid cooling solutions for AI Server, HPC, and Data Centre applications. This is a strategic leadership role combining technology innovation, organisational development, customer engagement, and product commercialisation.
  • Leading innovator in AI server and data centre liquid cooling.
  • Build and lead the next generation liquid cooling R&D team.

關於我們的客戶

A a specialised thermal solutions provider focused on advanced cooling technologies for high-performance computing, AI servers, and data centre applications. The company is investing heavily in next-generation liquid cooling platforms and is working closely with leading customers to develop efficient, reliable, and scalable cooling solutions for the future of AI computing.

職務說明

  • Develop and execute technology roadmaps for AI Server, HPC, and Data Centre liquid cooling solutions.
  • Lead the complete product development lifecycle, from concept design and engineering validation through production launch and mass deployment.
  • Build, develop, and manage multidisciplinary engineering teams, including thermal, mechanical, systems, and validation engineers.
  • Partner with customers to define product specifications, technical requirements, and competitive cooling architectures.
  • Drive innovation in liquid cooling technologies and identify opportunities for new product development.
  • Establish engineering processes, technical standards, and quality management systems to support sustainable growth.
  • Collaborate closely with manufacturing, quality, supply chain, and commercial teams to ensure successful product industrialisation.
  • Participate in strategic customer engagements, technical reviews, and business development activities to expand market presence within the AI infrastructure sector.
  • Mentor engineering leaders and develop organisational capabilities to support future growth.

理想的應徵者

  • Bachelor's degree or above in Mechanical Engineering, Thermal Engineering, Energy Engineering, or a related discipline.
  • 10+ years of experience in thermal management, cooling technologies, or related product development environments.
  • Minimum 5 years of engineering leadership experience managing technical teams and complex development programmes.
  • Strong experience in server thermal solutions, liquid cooling systems, AI infrastructure, HPC platforms, or data centre equipment.
  • Deep understanding of heat transfer, fluid dynamics, thermal architecture, and product reliability validation.
  • Hands-on CFD simulation experience using tools such as Icepak, FloTHERM, STAR-CCM+, ANSYS Fluent, or equivalent.
  • Experience with Cold Plate, Direct Liquid Cooling (DLC), CDU, or other advanced liquid cooling technologies.
  • Proven ability to lead cross-functional projects and drive product commercialisation.
  • Strong communication skills with the ability to engage customers in technical and business discussions.
  • Fluent English communication skills are highly preferred.

福利待遇

  • Competitive compensation package and long-term career development opportunities.
  • Executive-level ownership of a rapidly growing liquid cooling business.
  • Opportunity to influence next-generation AI infrastructure technologies.
  • Leadership of multidisciplinary engineering organisations.
  • Direct engagement with leading AI server and data centre customers.
  • Fast-paced, innovation-driven environment with significant growth potential.
聯絡
Joey Chen
職務編號
JN-092026-7103996
手機號
+886287298214

職務概要

職務類別
工程與製造
子類別
工程設計、研發及新產品導入
產業
工業/製造
地區
新北市
合約類型
全職
招募顧問名稱
Joey Chen
招募顧問電話
+886287298214
職務編號
JN-092026-7103996

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