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Dry Etch Process Development

海外地區 全職 查看職務說明
Join a highly advanced semiconductor R&D environment focused on developing future-generation memory technologies. This role offers the opportunity to lead critical dry etch process innovation, influence technology roadmaps, and collaborate with cross-functional experts to solve some of the industry's most complex scaling challenges.
  • Lead next-generation NAND dry etch technology development
  • Drive innovation in advanced semiconductor process R&D

關於我們的客戶

Our client is a globally recognised semiconductor technology leader at the forefront of memory and storage innovation. With a worldwide footprint spanning multiple countries, extensive R&D investments, and advanced manufacturing facilities, the organisation plays a significant role in enabling next-generation technologies across data centres, artificial intelligence, mobile devices, automotive applications, and cloud computing infrastructure.

職務說明

  • Lead the development and optimisation of advanced dry etch processes supporting next-generation memory technologies.
  • Drive process innovation to meet challenging device architecture, structural and electrical performance targets.
  • Define and execute technology development strategies for critical semiconductor process modules.
  • Partner closely with process integration, lithography, deposition, wet process, CMP and metallisation teams to solve complex manufacturing challenges.
  • Collaborate with equipment engineering teams and suppliers to establish future hardware and capability roadmaps.
  • Lead technical investigations, root cause analyses and problem-solving initiatives involving high aspect ratio and advanced pattern transfer applications.
  • Present technical findings, project updates and development strategies to senior stakeholders while mentoring junior engineers and contributing to technical leadership initiatives.

理想的應徵者

  • Bachelor's, Master's or PhD in Chemical Engineering, Mechanical Engineering, Electrical Engineering, Materials Science, Physics, Chemistry, Semiconductor Engineering or a related discipline.
  • Strong experience supporting R&D and technology development programmes transitioning into manufacturing environments.
  • Deep understanding of plasma etching fundamentals, plasma chemistry, surface interactions and transport phenomena.
  • Proven track record leading complex technical projects and cross-functional engineering teams.
  • Experience developing solutions for high aspect ratio etch applications and advanced pattern transfer challenges.
  • Strong knowledge of semiconductor dry etch equipment, process characterisation methodologies and statistical process control.
  • Experience managing supplier collaboration, technical evaluations and equipment development initiatives.
  • Proficiency in data analysis tools and statistical software, with exposure to data science, Python, automation or AI-driven process optimisation considered advantageous.

福利待遇

  • Opportunity to contribute directly to the development of future-generation semiconductor memory technologies.
  • Exposure to cutting-edge R&D programmes addressing some of the industry's most complex process integration challenges.
  • Comprehensive learning and development programmes, including technical leadership training.
  • International exposure through collaboration with global R&D, manufacturing and equipment partners.
聯絡
Eugenia NG (Lic No: R1108105 / EA no:18S9099)
職務編號
JN-092026-7114173
手機號
+65 6541 9961

職務概要

職務類別
工程與製造
子類別
工程設計、研發及新產品導入
產業
半導體
地區
海外地區
合約類型
全職
招募顧問名稱
Eugenia NG (Lic No: R1108105 / EA no:18S9099)
招募顧問電話
+65 6541 9961
職務編號
JN-092026-7114173

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