儲存工作 返回搜尋 職務說明 概要 類似職務Lead next-generation memory architecture for AI, HPC, networking, and ASICs.Drive product from concept through silicon while working with executive level.關於我們的客戶Our client is a fast-growing semiconductor technology company focused on developing advanced silicon solutions for data-intensive applications. The organization combines deep expertise in system architecture, IP development, and custom SoC design, serving customers in emerging high-performance computing, AI, and networking markets.職務說明Define the architecture, specifications, and roadmap for advanced memory IP and SoC memory subsystems.Drive system-level memory strategies covering bandwidth, latency, power efficiency, scalability, and total cost optimization.Architect solutions utilizing technologies such as DDR5, LPDDR5X/LPDDR6, HBM3E/HBM4, SRAM, cache hierarchies, and memory coherency frameworks.Conduct architectural exploration, performance analysis, and modeling using software-based simulation environments.Partner closely with RTL, verification, DFT, physical design, packaging, firmware, and software teams to ensure successful implementation.Participate in customer-facing technical discussions, design reviews, and long-term product planning.Support silicon bring-up activities, debug efforts, and post-silicon performance optimization.理想的應徵者BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a related discipline.15+ years of semiconductor industry experience with significant architectural ownership.Demonstrated success delivering complex SoC, memory controller, or memory IP products from definition through production silicon.Strong expertise in multiple areas, including:DDR5, LPDDR5X, and LPDDR6HBM3E and HBM4SRAM and cache architectureMemory controllers and PHY technologiesMemory coherency protocolsAI accelerator or HPC system architectureHands-on experience with architectural modeling and simulation using C/C++, SystemC, Python, or related tools.Strong communication, leadership, and cross-functional collaboration skills.福利待遇Competitive executive-level compensation package with performance-based incentives.Opportunity to shape cutting-edge memory technologies and future silicon platforms.Global collaboration across engineering teams in multiple regions.High visibility with senior leadership and direct impact on product strategy.Career growth within a rapidly expanding semiconductor organization focused on next-generation computing solutions.聯絡Eddie Chien職務編號JN-102026-7120147手機號+886 2 8729 8260職務概要職務類別工程與製造子類別工程設計、研發及新產品導入產業半導體地區台灣合約類型全職招募顧問名稱Eddie Chien招募顧問電話+886 2 8729 8260職務編號JN-102026-7120147辦公模式在家工作或混合工作模式
