工程與製造職務

• This role focuses on developing and validating test solutions for power IC products. You will collaborate with cross-functional teams to ensure smooth product introduction and continuous improvement throughout the production cycle. The position involves both technical execution and analytical problem-solving.

This role partners closely with the CEO to drive alignment, execution, and decision-making across R&D teams. The position focuses on ensuring key initiatives progress effectively by resolving cross-functional gaps and improving organizational clarity.

此職位負責NB BIOS進階技術開發與疑難問題解決。角色以技術深耕為主，並需在必要時與客戶溝通專案進度與技術議題。

Join a fast-growing semiconductor company developing next-generation post-quantum secure chips for AI and edge computing applications.
This role focuses on advanced node physical design, driving full APR flow and leading successful tape-outs at cutting-edge process nodes.

本職務將負責設備相關的維護、開發與優化工作，確保產線品質與設備稼動率。您將與跨部門合作，推動製程改善與新設備導入，是產線穩定的重要角色。

Drive product engineering from concept to product release

Collaborate with global teams to deliver gaming innovations

• 此職位聚焦於記憶體產品（DRAM 模組 或 NAND/SSD 解決方案）的開發、驗證與量產導入，涵蓋產品規格定義、測試驗證、不良分析與跨部門協作。
• 您將與內外部夥伴密切合作，確保產品在效能、可靠度與相容性上的競爭力，並支援客戶與市場端的技術需求。

本職位負責確保公司在工業製造領域的健康、安全及環境（HSE）管理系統的有效運作，並推動相關政策以符合國內外法規及標準。HSE經理將常駐台北市，協助工程與製造部門提升安全與環境表現，確保員工及營運的安全性。

This role leads manufacturing engineering strategy for a cutting-edge Co-Packaged Optics programme, focusing on automation, scalability, and cost efficiency. You will collaborate cross-functionally to industrialise advanced technologies while driving yield improvement and long-term operational excellence.

This role leads the development of advanced high‑speed products for datacentre applications, overseeing the full lifecycle from concept to production. You will guide global engineering teams, align cross‑functional stakeholders, and ensure delivery of high‑quality solutions that meet evolving market demands.

This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.

This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.

The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.

You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.

This role focuses on developing next-generation liquid filtration products for semiconductor wet process applications. The successful candidate will lead NPD projects from concept through commercialisation, using DOE and statistical analysis to drive performance improvements.

Technologist based in Hsinchu City, focusing on advanced process technologies, yield optimisation, and cross-functional collaboration with global teams to support product development and high-volume manufacturing.

We are seeking an experienced and visionary Analog Design Manager to lead a high-performing team of over 10 analog/mixed-signal engineers. This role is pivotal in driving innovation and execution across multiple domains including signal chain, power, and SerDes.

This role focuses on the design and development of analog/mixed-signal ICs for power management applications, including DC/DC converters, LDOs, and charge pumps. The engineer will lead circuit-level design, verification, and evaluation, working cross-functionally to bring high-performance products from concept to production.

此職務負責建立並領導嵌入式系統測試團隊，結合技術領導與團隊管理。您將制定測試策略、推動自動化與品質提升，確保整體產品生命週期的驗證品質。

此職位負責製程module的整體運營與管理，包含產能規劃、排程執行及生產效率提升。領導團隊完成階段性目標並達成設定指標。

The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.

負責台灣、美國及全球資料中心建置專案，與美國 Infra Lead密切合作。領導跨部門團隊，管理從設計、施工到系統測試的全流程，並與全球供應商與合作夥伴協作，確保專案如期、高品質完成。

• 此職位將負責高科技製造廠區的職業安全衛生管理，確保工廠符合國際EHS標準及台灣法規，並持續提升安全管理制度。
• 同時將輔助安全文化推動、承攬商管理、緊急應變、BCM及永續發展等專案，成為工廠EHS的重要推動者。

此職位負責 LiDAR 硬體與軟體專案的全流程管理，從需求整理到交付，確保專案達成產品與商業目標。您將與跨部門團隊及客戶密切合作，推動專案進度、風險控管及品質管理。

這是一個結合 Android 系統、SoC 平台與硬體互動的測試工程角色，能實際參與晶片效能、功耗與系統穩定度驗證。

你將與資深工程團隊合作，深入參與高效能處理器與行動平台的關鍵測試專案。

• 這是一個負責大型公共運輸基礎建設專案之 EHS 管理角色，需負責現場職安衛監督、文件送審與專案安全管理，並與業主及現場團隊密切協作。
• 該職位將參與軌道交通相關工程，從設計期的制度與文件管理，到後續現場施工與號誌系統導入，扮演專案安全核心角色。

此職位負責帶領BIOS團隊執行專案開發、維護與功能導入，並與硬體工程師密切合作進行系統除錯與整合。角色同時需評估RFQ規格並推動BIOS技術最佳化，確保產品品質與時程。

此職位負責新竹大型工程專案之工地 HSE 全面管理，從專案初期到完工，主導健康、安全、環境與保全相關策略與落地執行。

角色需在業主、工程團隊與多家承包商之間，建立一致且高標準的安全文化，確保高風險建廠專案零事故推進。

負責電動載具電子系統的整體設計與整合， 帶領團隊完成從架構定義、開發驗證到量產導入的完整流程。 需跨部門與供應商緊密合作，確保產品性能、法規與品質達標。

負責售後維修服務的整體營運管理，包括維修流程、零件庫存、成本控管與品質提升。

本職缺專注於高分子材料開發，面向電子載板應用領域。適合具博士學歷的人選，運用深厚材料科學基礎，推動新材料設計、配方優化與製程導入，實現性能與商業化雙重突破。