工程與製造職務 - 工程與製造類別

This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.

Leads advanced structural and thermal FEA for complex systems.

You will act as a subject matter expert guiding design and reliability decisions.

Leads global technology integration and technical support strategy across complex visual and collaboration solutions.

You will define scalable architectures, empower technical teams, and elevate customer and partner experience worldwide.

This role provides engineering expertise to design, develop, and enhance semiconductor test sockets and related fixtures to meet customer and quality requirements. You will work closely with cross‑functional teams to deliver robust, high‑performance products that support business growth and customer satisfaction.

The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.

You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.

This role focuses on developing next-generation liquid filtration products for semiconductor wet process applications. The successful candidate will lead NPD projects from concept through commercialisation, using DOE and statistical analysis to drive performance improvements.

This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.

Drive board‑level SI/PI analysis and simulation for high‑speed consumer hardware, ensuring robust performance across complex PCB and system architectures. You'll work closely with development teams to identify design risks early, optimize interconnects and PDN, and translate simulation insights into concrete design improvements.

Technologist based in Hsinchu City, focusing on advanced process technologies, yield optimisation, and cross-functional collaboration with global teams to support product development and high-volume manufacturing.

We are seeking an experienced and visionary Analog Design Manager to lead a high-performing team of over 10 analog/mixed-signal engineers. This role is pivotal in driving innovation and execution across multiple domains including signal chain, power, and SerDes.

This role focuses on the design and development of analog/mixed-signal ICs for power management applications, including DC/DC converters, LDOs, and charge pumps. The engineer will lead circuit-level design, verification, and evaluation, working cross-functionally to bring high-performance products from concept to production.

The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.

This role leads the development of next-generation Flash IP products. You will own product definition, technical direction, and execution from concept through volume production, bridging technology innovation with market needs.

• 此職位聚焦於記憶體產品（DRAM 模組 或 NAND/SSD 解決方案）的開發、驗證與量產導入，涵蓋產品規格定義、測試驗證、不良分析與跨部門協作。
• 您將與內外部夥伴密切合作，確保產品在效能、可靠度與相容性上的競爭力，並支援客戶與市場端的技術需求。

本職位負責確保公司在工業製造領域的健康、安全及環境（HSE）管理系統的有效運作，並推動相關政策以符合國內外法規及標準。HSE經理將常駐台北市，協助工程與製造部門提升安全與環境表現，確保員工及營運的安全性。

本職務將負責設備相關的維護、開發與優化工作，確保產線品質與設備稼動率。您將與跨部門合作，推動製程改善與新設備導入，是產線穩定的重要角色。

此職位負責新產品從Early Engage到量產的NPI全流程管控，整合研發、製造與品質資源，確保專案如期高品質交付。

同時需帶領團隊進行良率、成本與工程標準化優化，支撐客戶長期策略合作。

我們的客戶為全球級電子系統解決方案供應商，深耕 ODM/JDM 業務，產品廣泛應用於 Camera、AIoT 與 Networking 領域。

組織制度成熟、重視專案治理與流程紀律，並長期服務國際級客戶。

此職位將全面負責 ARVR 穿戴式產品新廠的建置、產線導入與量產營運管理，確保工廠依國際標準運作。帶領跨部門團隊提升製造品質、效率、成本結構並推動智慧製造發展。

此職位負責資料中心、AI Server 與標準機架式伺服器的平台產品策略與產品藍圖，確保市場競爭力與長期業務成長。角色需高度跨部門協作能力，並能與客戶、供應鏈與生態系夥伴緊密合作，推動產品成功落地。

此職位負責從市場、法規與商業模型出發，定義能源產品在市場中的策略方向、商業定位與價值主張。你不僅參與產品開發，更主導「做什麼產品、服務誰、如何成功進入市場」，推動能源業務的商業化落地。

負責台灣、美國及全球資料中心建置專案，與美國 Infra Lead密切合作。領導跨部門團隊，管理從設計、施工到系統測試的全流程，並與全球供應商與合作夥伴協作，確保專案如期、高品質完成。

此職位負責 LiDAR 硬體與軟體專案的全流程管理，從需求整理到交付，確保專案達成產品與商業目標。您將與跨部門團隊及客戶密切合作，推動專案進度、風險控管及品質管理。

負責電源供應器（PSU）之客戶端技術支援與應用除錯，涵蓋測試、 驗證與現場問題排除。

作為客戶與內部研發、產品團隊之技術橋樑，支援全球專案推進。

主導從概念設計到量產的整體產品開發，融合機械工程與工業設計，打造具備結構穩定性、美學一致性與食品安全合規的創新機器人產品。

此職位負責mid-board光收發模組的嵌入式韌體架構、開發與系統整合。你將確保模組在效能、可靠度、標準合規與系統互通性上的卓越表現，並橫跨產品全生命週期。

此職位負責台灣地區半導體關鍵供應商的全生命週期品質管理，涵蓋供應商准入、稽核、異常處理與持續改善。
將與晶圓廠及供應商密切合作，確保 Fab 製程相關產品與材料品質穩定並符合出貨要求。

• 此職位為製藥工廠端的 EHS（環安衛）主管角色，全面負責廠區 EHS 法規合規、制度建立、文化推動與對外稽查管理，確保人員安全、營運穩定。
• 同時身處集團核心位置，需將成熟的 EHS 管理架構與標準，延伸並落地至海外據點，具備策略與實務並重的影響力。

此職位負責新竹大型工程專案之工地 HSE 全面管理，從專案初期到完工，主導健康、安全、環境與保全相關策略與落地執行。

角色需在業主、工程團隊與多家承包商之間，建立一致且高標準的安全文化，確保高風險建廠專案零事故推進。

此職位負責規劃並領導網路交換器 BSP 與 Linux Kernel/Driver 的整體開發流程，從底層驅動到系統穩定度全面掌握。

將與產品與專案團隊緊密合作，確保系統效能、可靠度與量產交付品質，同時負責團隊管理與技術決策。