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This role leads global supplier and manufacturing quality for advanced semiconductor and board-level products, partnering with fabs, OSATs and PCB/PCBA suppliers worldwide. It combines deep hands-on quality engineering leadership with advanced data analytics to predict risks, improve yield and scale quality with AI infrastructure growth.
此職位負責企業級 Access Point(AP)系統的核心模組整合、效能優化與系統層問題分析。你將橫跨 Wi‑Fi、Linux networking、雲端控制器與驅動層,打造高穩定、高效能的無線平台。
This role leads product, project execution, and cross‑functional alignment for semiconductor packaging technologies. You will manage development programs, drive data‑based decisions, and ensure successful market introduction.
此職位為總部端全球Quality Management的角色,負責統一各國代工體系的Quality運作模式,並以數據驅動品質決策與風險預防。 你將從策略層級影響多國供應鏈品質表現,並以跨國管理與制度建立為核心價值。
The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.
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