工程與製造職務

Lead technical engagement with data centre customers, focusing on air and liquid cooling systems. This role combines thermal engineering expertise with customer-facing responsibilities to deliver high-efficiency cooling solutions for AI-driven workloads and high-density racks.

你是否熱衷於製程優化、數據分析，並帶領第一線團隊持續成長？
我們正在尋找一位 Process Lead（製程組長），加入一家國際級FMCG製造企業，一起打造高效且卓越的生產現場。

This role is responsible for driving business growth and strategy execution in Taiwan. You will lead the local team, manage P&L performance, and continuously improve resource utilization and service quality. The position involves overseeing daily operations to ensure sustainable growth and enhanced productivity.

We are expanding our Analog / Mixed-Signal IP Engineering team and are hiring experienced Analog Design Engineers across multiple technical specialties. Depending on expertise, candidates will contribute from architecture definition through tape-out and silicon bring-up. Work location is flexible: Taiwan or Penang, Malaysia.

This role leads factory development, capital project execution, mechanical design review, and commissioning activities. You will ensure engineering quality, construction compliance, and long‑term equipment reliability across the plant.

This role leads manufacturing engineering strategy for a cutting-edge Co-Packaged Optics programme, focusing on automation, scalability, and cost efficiency. You will collaborate cross-functionally to industrialise advanced technologies while driving yield improvement and long-term operational excellence.

This role leads the development of advanced high‑speed products for datacentre applications, overseeing the full lifecycle from concept to production. You will guide global engineering teams, align cross‑functional stakeholders, and ensure delivery of high‑quality solutions that meet evolving market demands.

This role owns end‑to‑end hardware development for high‑power server power supplies.

You will lead circuit design, validation, and cross‑functional collaboration.

This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.

Leads hardware development of BBU power systems for servers and data centre applications.

You will manage teams, define architectures, and drive products to mass production.

This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.

Leads advanced structural and thermal FEA for complex systems.

You will act as a subject matter expert guiding design and reliability decisions.

Leads global technology integration and technical support strategy across complex visual and collaboration solutions.

You will define scalable architectures, empower technical teams, and elevate customer and partner experience worldwide.

This role provides engineering expertise to design, develop, and enhance semiconductor test sockets and related fixtures to meet customer and quality requirements. You will work closely with cross‑functional teams to deliver robust, high‑performance products that support business growth and customer satisfaction.

The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.

You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.

This role focuses on developing next-generation liquid filtration products for semiconductor wet process applications. The successful candidate will lead NPD projects from concept through commercialisation, using DOE and statistical analysis to drive performance improvements.

Technologist based in Hsinchu City, focusing on advanced process technologies, yield optimisation, and cross-functional collaboration with global teams to support product development and high-volume manufacturing.

We are seeking an experienced and visionary Analog Design Manager to lead a high-performing team of over 10 analog/mixed-signal engineers. This role is pivotal in driving innovation and execution across multiple domains including signal chain, power, and SerDes.

This role focuses on the design and development of analog/mixed-signal ICs for power management applications, including DC/DC converters, LDOs, and charge pumps. The engineer will lead circuit-level design, verification, and evaluation, working cross-functionally to bring high-performance products from concept to production.

The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.

本職務將負責設備相關的維護、開發與優化工作，確保產線品質與設備稼動率。您將與跨部門合作，推動製程改善與新設備導入，是產線穩定的重要角色。

• 此職位聚焦於記憶體產品（DRAM 模組 或 NAND/SSD 解決方案）的開發、驗證與量產導入，涵蓋產品規格定義、測試驗證、不良分析與跨部門協作。
• 您將與內外部夥伴密切合作，確保產品在效能、可靠度與相容性上的競爭力，並支援客戶與市場端的技術需求。

本職位負責確保公司在工業製造領域的健康、安全及環境（HSE）管理系統的有效運作，並推動相關政策以符合國內外法規及標準。HSE經理將常駐台北市，協助工程與製造部門提升安全與環境表現，確保員工及營運的安全性。

主要負責癌症基因檢測的臨床NGS生物資訊分析流程之執行與維護。你將與跨部門合作，確保分析結果的準確性、符合法規要求，並維持產線穩定運作。

此職位負責製程module的整體運營與管理，包含產能規劃、排程執行及生產效率提升。領導團隊完成階段性目標並達成設定指標。

• 這是一個結合醫療器材法規與品質系統管理的關鍵職位，負責台灣市場的產品註冊、GDP/QMS維護、內部稽核與主管機關應對，確保產品與營運流程符合法規要求。
• 角色同時會橫跨倉儲、客訴、警戒通報與跨部門協作，是連結商業營運、法規合規與品質管理的重要窗口。

我們的客戶為全球級電子系統解決方案供應商，深耕 ODM/JDM 業務，產品廣泛應用於 Camera、AIoT 與 Networking 領域。

組織制度成熟、重視專案治理與流程紀律，並長期服務國際級客戶。

此職位負責資料中心、AI Server 與標準機架式伺服器的平台產品策略與產品藍圖，確保市場競爭力與長期業務成長。角色需高度跨部門協作能力，並能與客戶、供應鏈與生態系夥伴緊密合作，推動產品成功落地。

此職位負責從市場、法規與商業模型出發，定義能源產品在市場中的策略方向、商業定位與價值主張。你不僅參與產品開發，更主導「做什麼產品、服務誰、如何成功進入市場」，推動能源業務的商業化落地。

負責台灣、美國及全球資料中心建置專案，與美國 Infra Lead密切合作。領導跨部門團隊，管理從設計、施工到系統測試的全流程，並與全球供應商與合作夥伴協作，確保專案如期、高品質完成。