Engineering職務

Leads the Engineering organization across Asia-Pacific, overseeing customer design‑ins, technical debugging, validation, and high‑speed connectivity platform integration. It serves as the primary technical bridge between global customers and engineering teams, influencing product roadmaps for next‑generation optical and data‑center interconnect solutions.

This is an exciting opportunity for a CTO / Head of Engineering to lead technological innovation and drive engineering excellence in the insurance industry. The role is focused on overseeing the development of advanced solutions and ensuring the seamless integration of cutting-edge technology.

此職位負責機器人軟硬體整合，從行為開發、機電設計到系統驗證都能完整參與。你將在實驗環境中與資深工程師協作，快速迭代並提升機器人整體效能。

We are seeking a Cybersecurity Engineer with approximately 5 years of experience to join our security team. In this role, you will gain hands-on exposure across security operations, contribute to security architecture, and support developers and IT teams with security best practices.

此職位負責半導體設備的現場全方位服務，確保客戶滿意度與設備效能。你將支援設備安裝、試機、問題排除與技術協助。

此職位負責半導體設備的現場全方位服務，確保客戶滿意度與設備效能。你將支援設備安裝、試機、問題排除與技術協助，也須為客戶與其他相關人員提供有效的設備操作、校正與維護訓練

結合雲端專業知識 & 網路安全深度，主導企業級混合雲解決方案。

此職位負責管理整體測試工程團隊，制定測試策略、優化流程，並確保產品在開發與量產階段達到高品質標準。將串聯跨部門資源，帶領團隊提升測試效能與成熟度。

此職位負責 SoC 整合、數位邏輯設計、IP 整合與 FPGA/ASIC 驗證，並主導從前期架構到 Tape‑out 的完整流程。您將與跨部門工程團隊合作，打造高效能與高安全性的先進晶片解決方案。

This role provides strategic and operational leadership across engineering and machine development, overseeing the conception, development, and deployment of advanced manufacturing technologies and equipment. The position is critical to enabling long term growth, competitiveness, and operational sustainability within a highly regulated environment.

• 負責中大型系統整合與 Cloud Architecture 設計
• 規劃並執行 AI 系統的上線流程、與 IT 團隊協作解決系統串接中的技術難題

在世界級的舞台，定義 AI 在金融領域的未來應用。
我們正在尋找一位具備 8 年以上實戰經驗的技術人才，主導從 LLM 集成到 MLOps 自動化部署的核心開發。

這是一份讓你結合 Data Engineering 與 AI 數據準備 的核心職缺。
你將運用 Python、SQL、Airflow、雲端與容器化技術，打造新一代數據平台與治理機制。

• We are seeking an experienced and forward‑thinking engineering leader to drive the development of next‑generation LiDAR modules. This role offers the opportunity to shape core product architecture, lead a skilled technical team, and deliver breakthrough innovations in sensing hardware.
  

This role centers on signal‑chain and sub‑block IC development, including ADCs, DACs, and various analog amplifiers. You will also engage in designing power‑related and auxiliary circuits across multiple CMOS/BCD process technologies. The position offers end‑to‑end ownership from architecture to silicon validation.

• This role leads mechanical design and cross‑functional coordination for advanced consumer electronics products while ensuring technical, customer, and project requirements are fully met. You will work closely with global clients and internal engineering teams to drive product excellence from concept to mass production.
  

The position of Hardware R&D Manager focuses on leading and overseeing hardware development projects within the technology and telecoms industry. This role is based in New Taipei City and requires expertise in hardware engineering and team management.

Design and deliver high‑quality fitness products through a design‑build‑test development culture.

You will collaborate across functions to translate user needs into reliable, scalable electromechanical solutions.

Drive board‑level SI/PI analysis and simulation for high‑speed consumer hardware, ensuring robust performance across complex PCB and system architectures. You'll work closely with development teams to identify design risks early, optimize interconnects and PDN, and translate simulation insights into concrete design improvements.

Leads the architecture, development, and validation of advanced storage hardware platforms built on high-speed PCIe and next‑generation interconnect technologies. Shaping the system‑level roadmap from design and standards compliance through manufacturing readiness, ensuring that products perform reliably at scale.

This role leads product, project execution, and cross‑functional alignment for semiconductor packaging technologies. You will manage development programs, drive data‑based decisions, and ensure successful market introduction.

This role focuses on developing and optimizing low‑level software-including kernel, drivers, BSP, and system services-for next‑generation VR headset platforms. You will lead hardware bring‑up, system integration, and performance tuning across a complex multi‑team environment.

負責領導硬體研發團隊，從新產品開發、現有平台優化到跨部門協作，確保類比相關電路設計具備卓越品質與市場競爭力。此職位同時需要深入理解客戶需求，以技術決策驅動創新並提升團隊整體能力。

The MD will spearhead the end‑to‑end operating agenda for a diversified conglomerate. The mandate covers portfolio performance, cost leadership, and disciplined growth, with accountability for cross‑border M&A integration, greenfield delivery, and asset optimization. The executive will be the primary catalyst for operating standardization, reliability, and expansion across multiple Asian jurisdictions.

負責管理工廠的日常生產營運，並帶領團隊推動各項流程改善與效率提升，以確保主要產線在品質、產能與成本上持續達成目標。

This role leads factory development, capital project execution, mechanical design review, and commissioning activities. You will ensure engineering quality, construction compliance, and long‑term equipment reliability across the plant.

This role leads the quality function for the Power & System business unit, driving new quality technologies, TQM enhancement, and continuous customer satisfaction improvement. It also oversees team management and partners closely with R&D on DQE and engineering quality, which accounts for around 50% of the role.

Designs and validates thermal solutions for AI server systems, ensuring optimal cooling performance and product reliability. You will perform simulations, conduct testing, and work closely with cross‑disciplinary teams to deliver robust thermal architectures.

This role leads end‑to‑end development of sensing systems used across next‑generation consumer electronics. You will drive innovation from concept through mass production while collaborating globally across multidisciplinary engineering teams.

This role drives operational excellence by translating business priorities into actionable plans and leading cross‑functional teams through complex, high‑impact projects. It focuses on enhancing organizational capability, supporting new product industrialization, and enabling continuous improvement across manufacturing operations.