儲存工作 返回搜尋 職務說明 概要 類似職務Work on advanced packaging technologies from QFN to WLCSP and flip-chip solutionCollaborate with global engineering teams and product development.關於我們的客戶Our client is a leading global fabless company focused on developing innovative semiconductor solutions for consumer and electronics applications. With a strong engineering culture and commitment to technical excellence, the organization invests heavily in advanced product development, employee growth, and cross-functional collaboration across international teams.職務說明Lead package design activities for advanced semiconductor products, ensuring performance, reliability, and manufacturability targets are achieved.Define electrical, mechanical, and thermal package requirements in collaboration with IC design and layout teams.Utilize package design and simulation tools to develop physical layouts, validate designs, and support manufacturing readiness.Establish and maintain package design rules for technologies such as WLCSP, wire bond, flip-chip, and other advanced packaging solutions.Perform design-for-manufacturing (DFM) reviews and implement improvements to enhance assembly yield and reduce production risks.Drive continuous improvement and automation initiatives throughout the package development process.Develop and evaluate test vehicles to validate package performance and signal integrity considerations.Partner closely with customers, manufacturing partners, and internal stakeholders to resolve design challenges and optimize package implementation.理想的應徵者Bachelor's degree or above in Mechanical Engineering, Electrical Engineering, Materials Science, Chemical Engineering, or a related discipline.5+ years of experience in semiconductor packaging or a related technical field.Hands-on experience with package layout tools, particularly Cadence SiP Layout and AutoCAD.Strong understanding of package materials, substrate design, assembly processes, and packaging technologies.Ability to interpret electrical simulation results and apply them to package optimization.Excellent communication and stakeholder management skills with the ability to present technical concepts to both engineering and leadership teams.Self-motivated, detail-oriented, and capable of driving projects independently.Experience with PCB, die layout, simulation, or advanced design tools is highly desirable.福利待遇Competitive compensation package and performance-based rewards.Exposure to cutting-edge semiconductor packaging technologies and global product development programs.Opportunities for technical leadership, career advancement, and continuous professional development.Collaborative, inclusive, and innovation-driven work environment.Flexible working arrangement with hybrid work opportunities and access to advanced engineering resources and training programs.聯絡Eddie Chien職務編號JN-072026-7071893手機號+886 2 8729 8260職務概要職務類別工程與製造子類別電子產業半導體地區新竹合約類型全職招募顧問名稱Eddie Chien招募顧問電話+886 2 8729 8260職務編號JN-072026-7071893辦公模式在家工作或混合工作模式
