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Application Engineer-Advanced Electrolytic Plating

桃園 全職 查看職務說明
We are seeking an Sr. AE to support the development and optimisation of advanced electroplating and metal deposition processes for electronics manufacturing applications. This role combines lab experimentation, process troubleshooting, customer-facing technical support, and collaboration with global teams to deliver innovative plating solutions and drive successful product adoption.
  • Join a global team driving innovation in advanced electroplating technologies.
  • Gain exposure to customers, product qualifications, and process development.

關於我們的客戶

  • Our client is a global technology company specialising in advanced manufacturing solutions and process technologies for the electronics industry. With a strong commitment to innovation and customer success, the company partners with leading manufacturers to develop high-performance solutions that support next-generation electronic devices and applications.

職務說明

    • Develop, evaluate, and optimise electroplating processes to improve product performance and manufacturing efficiency.
    • Design and execute laboratory experiments, analyse results, and recommend process improvements based on data-driven findings.
    • Provide technical support and troubleshooting for customers, identifying root causes and implementing effective solutions.
    • Collaborate with sales, product management, R&D, and engineering teams to support new product introductions and market adoption.
    • Generate technical reports, application notes, presentations, and customer documentation.
    • Participate in product qualification activities and contribute to application development projects across global regions.
    • Identify opportunities for process innovation and support the expansion of existing and emerging applications.

理想的應徵者

    • Bachelor's or Master's degree in Chemistry, Chemical Engineering, Materials Science, Surface Technology, or a related discipline.
    • Experience within the electronics manufacturing industry, preferably in PCB, semiconductor, or surface finishing applications.
    • Knowledge of electroplating, electrochemical deposition, or related wet process technologies is highly preferred.
    • Hands-on experience in process development, manufacturing support, technical service, or industrial operations.
    • Strong analytical mindset with the ability to solve complex technical challenges using a structured approach.
    • Excellent communication and presentation skills, with the ability to interact effectively with customers and internal stakeholders.
    • Self-motivated, organised, and capable of managing multiple projects in a fast-paced environment.
    • Fluent in English, both written and spoken.
    • Willingness to travel internationally up to approximately 30%.

福利待遇

  • Competitive salary package with performance-based incentives.
  • Opportunity to work with industry-leading electroplating technologies and global customers.
  • International exposure through collaboration with regional and global teams.
  • Comprehensive training and professional development programmes.
  • A dynamic and innovative environment that encourages technical growth and career progression.
  • The chance to make a direct impact on cutting-edge electronics manufacturing solutions worldwide.



聯絡
Minna Wu
職務編號
JN-082026-7079429
手機號
+886287298206

職務概要

職務類別
工程與製造
子類別
化學/製程
產業
工業/製造
地區
桃園
合約類型
全職
招募顧問名稱
Minna Wu
招募顧問電話
+886287298206
職務編號
JN-082026-7079429

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