工程與製造職務 - 台北市地區

This role leads global server hardware strategy, development, and delivery for a fast‑growing enterprise infrastructure business. You will drive platform innovation, manage global teams, and partner closely with customers and suppliers.

This role is for a expert-level power module design engineer responsible for end‑to‑end development of high‑performance power module products. You will drive technical innovation, collaborate globally, and influence product direction from concept through production.

此職位負責 AIoT、安防或網通產品之機構設計，從概念階段一路推進至量產。
您將與跨部門團隊及全球合作夥伴緊密合作，打造高品質且具成本競爭力的產品。

This role leads the Generic and AI Server project management. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

This role leads the design, validation, and delivery of Generic and AI Server hardware, owning critical technical decisions while ensuring quality, cost, and schedule targets are met. The position collaborates closely with global customers and cross‑functional teams, driving next‑generation server solutions and mentoring engineers.

• We are seeking an experienced and forward‑thinking engineering leader to drive the development of next‑generation LiDAR modules. This role offers the opportunity to shape core product architecture, lead a skilled technical team, and deliver breakthrough innovations in sensing hardware.
  

Focuses on mechanical design of connector products and components.

You will translate requirements into robust, manufacturable designs.

This role focuses on front‑end mechanical design of cable and connector systems.

You will define structures, interfaces, and manufacturable designs from early phases.

此職位負責 AIoT、安防或網通產品之機構設計，從概念階段一路推進至量產。
您將與跨部門團隊及全球合作夥伴緊密合作，打造高品質且具成本競爭力的產品。

This role leads the quality function for the Power & System business unit, driving new quality technologies, TQM enhancement, and continuous customer satisfaction improvement. It also oversees team management and partners closely with R&D on DQE and engineering quality, which accounts for around 50% of the role.

• This role leads mechanical design and cross‑functional coordination for advanced consumer electronics products while ensuring technical, customer, and project requirements are fully met. You will work closely with global clients and internal engineering teams to drive product excellence from concept to mass production.
  

This role leads product engineering activities during mass production for high‑speed semiconductor devices. You will ensure stable, high‑quality manufacturing while supporting yield, test optimization, and on‑time customer delivery across the product lifecycle.

This role leads ATE test strategy and execution for complex mixed-signal SoC products used in high-speed computing and connectivity applications. You will own test development from early silicon to high-volume manufacturing, working closely with design teams and global manufacturing partners.

Lead technical engagement with data centre customers, focusing on air and liquid cooling systems. This role combines thermal engineering expertise with customer-facing responsibilities to deliver high-efficiency cooling solutions for AI-driven workloads and high-density racks.

This role leads the SI, PI and EMI function for large‑scale server platforms. You will define system‑level electrical robustness and guide teams from early architecture through high‑volume production.

Leads advanced structural and thermal FEA for complex systems.

You will act as a subject matter expert guiding design and reliability decisions.

Leads global technology integration and technical support strategy across complex visual and collaboration solutions.

You will define scalable architectures, empower technical teams, and elevate customer and partner experience worldwide.

The thermal engineer role will focuses on designing and validating advanced thermal solutions for high‑performance server platforms.

You will work across functions to ensure system reliability, efficiency, and scalability for data centre deployments.

The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.

• 此職位聚焦於記憶體產品（DRAM 模組 或 NAND/SSD 解決方案）的開發、驗證與量產導入，涵蓋產品規格定義、測試驗證、不良分析與跨部門協作。
• 您將與內外部夥伴密切合作，確保產品在效能、可靠度與相容性上的競爭力，並支援客戶與市場端的技術需求。

我們的客戶為全球級電子系統解決方案供應商，深耕 ODM/JDM 業務，產品廣泛應用於 Camera、AIoT 與 Networking 領域。

組織制度成熟、重視專案治理與流程紀律，並長期服務國際級客戶。

此職位負責資料中心、AI Server 與標準機架式伺服器的平台產品策略與產品藍圖，確保市場競爭力與長期業務成長。角色需高度跨部門協作能力，並能與客戶、供應鏈與生態系夥伴緊密合作，推動產品成功落地。

負責台灣、美國及全球資料中心建置專案，與美國 Infra Lead密切合作。領導跨部門團隊，管理從設計、施工到系統測試的全流程，並與全球供應商與合作夥伴協作，確保專案如期、高品質完成。

負責電源供應器（PSU）之客戶端技術支援與應用除錯，涵蓋測試、 驗證與現場問題排除。

作為客戶與內部研發、產品團隊之技術橋樑，支援全球專案推進。

主導從概念設計到量產的整體產品開發，融合機械工程與工業設計，打造具備結構穩定性、美學一致性與食品安全合規的創新機器人產品。

此職位負責mid-board光收發模組的嵌入式韌體架構、開發與系統整合。你將確保模組在效能、可靠度、標準合規與系統互通性上的卓越表現，並橫跨產品全生命週期。

此職位負責規劃並領導網路交換器 BSP 與 Linux Kernel/Driver 的整體開發流程，從底層驅動到系統穩定度全面掌握。

將與產品與專案團隊緊密合作，確保系統效能、可靠度與量產交付品質，同時負責團隊管理與技術決策。

此職位負責機器人軟硬體整合，從行為開發、機電設計到系統驗證都能完整參與。你將在實驗環境中與資深工程師協作，快速迭代並提升機器人整體效能。