工程與製造職務 - 台北市地區

• We are seeking an experienced and forward‑thinking engineering leader to drive the development of next‑generation LiDAR modules. This role offers the opportunity to shape core product architecture, lead a skilled technical team, and deliver breakthrough innovations in sensing hardware.
  

• This role leads mechanical design and cross‑functional coordination for advanced consumer electronics products while ensuring technical, customer, and project requirements are fully met. You will work closely with global clients and internal engineering teams to drive product excellence from concept to mass production.
  

This role leads the quality function for the Power & System business unit, driving new quality technologies, TQM enhancement, and continuous customer satisfaction improvement. It also oversees team management and partners closely with R&D on DQE and engineering quality, which accounts for around 50% of the role.

This role leads end‑to‑end execution of PC customer programs and SoC‑partner engagements, ensuring on‑time, high‑quality delivery across OEM platforms. You will act as the central driver aligning engineering, operations, sales, and customer teams to bring complex PC products to market.

You will be the regional technical leader for advanced solutions across APAC. In this role, you'll drive design‑in success at key customers, shape future products with your feedback, and build a local team of applications experts, working closely with world‑class design and engineers.

Lead technical engagement with data centre customers, focusing on air and liquid cooling systems. This role combines thermal engineering expertise with customer-facing responsibilities to deliver high-efficiency cooling solutions for AI-driven workloads and high-density racks.

This role leads technology integration and technical support for advanced meeting room and large-venue solutions. You will shape AV-over-IP strategies and empower teams to deliver exceptional customer experiences worldwide.

The position of Hardware R&D Manager focuses on leading and overseeing hardware development projects within the technology and telecoms industry. This role is based in New Taipei City and requires expertise in hardware engineering and team management.

This role focuses on developing and optimizing low‑level software-including kernel, drivers, BSP, and system services-for next‑generation VR headset platforms. You will lead hardware bring‑up, system integration, and performance tuning across a complex multi‑team environment.

負責領導硬體研發團隊，從新產品開發、現有平台優化到跨部門協作，確保類比相關電路設計具備卓越品質與市場競爭力。此職位同時需要深入理解客戶需求，以技術決策驅動創新並提升團隊整體能力。

Designs and validates thermal solutions for AI server systems, ensuring optimal cooling performance and product reliability. You will perform simulations, conduct testing, and work closely with cross‑disciplinary teams to deliver robust thermal architectures.

The Head of Applications - Asia will lead regional application engineering, technical deployment, and post-sales support across APAC.

此職位負責定義並推動硬體產品策略，從早期概念、NPI 到量產全程主導，並確保硬體、軟體與使用者體驗的無縫整合。你將與跨部門合作與 ODM 管理密切合作，確保產品品質、成本與時程達標。

負責台灣、美國及全球資料中心建置專案，與美國 Infra Lead密切合作。領導跨部門團隊，管理從設計、施工到系統測試的全流程，並與全球供應商與合作夥伴協作，確保專案如期、高品質完成。

主導從概念設計到量產的整體產品開發，融合機械工程與工業設計，打造具備結構穩定性、美學一致性與食品安全合規的創新機器人產品。

• 此職位負責桃園廠區之環境、安全與職業衛生管理，帶領團隊確保營運符合在地法規與企業全球標準，並持續優化ISO體系運作。
• 角色需結合人員管理、專案推動與跨國溝通能力，強化廠區風險控管與安全文化落實。

此職位負責 SoC 整合、數位邏輯設計、IP 整合與 FPGA/ASIC 驗證，並主導從前期架構到 Tape‑out 的完整流程。您將與跨部門工程團隊合作，打造高效能與高安全性的先進晶片解決方案。

此職位負責機器人軟硬體整合，從行為開發、機電設計到系統驗證都能完整參與。你將在實驗環境中與資深工程師協作，快速迭代並提升機器人整體效能。