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此職位負責伺服器電源解決方案的技術規劃、開發管理及產品導入，包括PSU、Power Shelf及相關電源架構設計評估。您將與客戶、供應商及內部跨部門團隊密切合作，確保產品開發符合效能、品質與時程需求。
我們正在尋找具備結構模擬分析經驗的工程師，負責伺服器產品的結構建模、強度驗證及可靠度分析，確保產品設計符合品質與性能要求。 此職位將與機構設計團隊及國際客戶密切合作，透過模擬與測試驗證持續優化產品設計與系統可靠性。
本職位將負責伺服器產品機構設計開發、驗證測試、問題分析及量產導入，並帶領團隊推動機構技術優化與專案執行。未來將朝主管職發展，與海外客戶及跨國研發團隊密切合作，共同開發新世代伺服器產品。
本職位將負責AI伺服器水冷散熱方案開發與團隊管理，涵蓋L10至L11設計整合、驗證及專案執行。您將與客戶、供應商及跨部門團隊密切合作，同時推動新世代散熱技術與模擬能力的持續優化。
此職位負責Outdoor Telecom Server及Edge AI Server產品的機構架構設計與系統整合，並擔任國際客戶的重要技術窗口。您將主導產品開發過程中的跨部門協作、技術問題解決及專案推動，確保產品品質、成本與時程目標達成。
本職位將負責伺服器DC/DC電源架構規劃、設計開發、驗證與量產導入，確保產品依時程與品質目標完成。您將與跨部門團隊、供應商及客戶密切合作，打造具市場競爭力的電源解決方案。
Drive customer process development, product evaluations and technical solutions for semiconductor packaging applications. Partner closely with customers, sales and engineering teams to optimize dispensing processes and support business growth.
This role is responsible for defining product strategy, managing the product lifecycle, and ensuring alignment between customer needs, market trends, and operational capabilities. The successful candidate will work cross-functionally with R&D, manufacturing, procurement, quality, logistics, and commercial teams to drive product performance, supply continuity, and profitability.
We are seeking an experienced Application Leader to drive application development and market adoption for advanced electronics materials of substrate materials. This role will lead a geographically diverse team, collaborate with customers and industry partners worldwide, and translate market needs into commercially successful solutions and technology roadmaps.
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