工程與製造職務 - 新北市地區

The Technical Director will lead engineering projects and oversee system development processes to ensure innovation and efficiency in the server sector.

This role requires a strong technical background to deliver high-quality solutions in a fast-paced environment

負責次世代伺服器的電子電路設計與驗證，參與從設計、測試到導入量產的全流程。

此職位需要具備硬體設計基礎與創新精神，能在高速發展的雲端架構中實現可靠、可擴展的產品設計。

This role leads the Project Management team, connecting R&D, procurement, supply chain, and manufacturing to ensure material accuracy and project alignment. You will drive process improvements, strengthen execution capabilities, and develop team talent for high-performance delivery.

負責硬體工程部門的策略規劃、設計與交付，涵蓋企業級及超大規模伺服器硬體解決方案。您將領導核心團隊，推動創新並確保設計品質與量產穩定性。

The Senior Optical Engineer will lead the design, development, and testing of advanced optical components, ensuring compliance with industry standards and driving product innovation.

This role combines technical leadership, hands-on engineering, and cross-functional collaboration to deliver high-performance solutions for global markets.

This role is responsible for strategic planning and technical innovation in datacentre power infrastructure, including AC/DC conversion, OCP High Power Rack standards, and end-to-end power architecture. You will collaborate with global vendors and internal teams to ensure readiness for hyperscale deployments.

As a Staff Electrical Engineer, you will lead the design and development of advanced electronic systems for high-performance consumer products. This role requires strong technical expertise and cross-functional collaboration to ensure designs meet stringent quality, reliability, and cost targets.

This is a senior technical leadership role focused on AI server development, combining cross-functional team management with client-facing technical communication.

專注於3D Vapor Chamber技術研發的主管職位，負責新產品開發與製程優化。

適合具備熱流技術背景、擁有團隊領導經驗並願意出差的技術領袖。

擔任硬體開發核心主管，領導設計跨架構主機板與背板，負責產品從概念、電路設計到量產導入。部門協調與全球客戶技術對接，結合技術深度與領導力。

機構工程師將負責產品設計和開發，確保符合技術規範並滿足客戶需求。從3D建模到模具開發全程參與。

負責高階Switch硬體架構設計與產品開發，涵蓋100G至1.6T高速交換器。您將主導規格制定、測試驗證，並協同跨部門完成產品設計，推動資料中心核心技術。

負責新一代高速運算電子產品的散熱設計與性能驗證，從設計初期到試產全程參與。透過熱流模擬與失效分析，確保產品在極端條件下仍具備穩定效能。