Save Job Back to Search Job Description Summary Similar JobsShape strategy for next-gen semiconductor packagingLead global innovation in advanced 3D-IC technologiesAbout Our ClientA global leader in high-performance materials and solutions for the semiconductor industry, known for its innovation and technical excellence across multiple product lines.Job DescriptionDeveloping and executing technology strategies for advanced packagingIdentifying new market opportunities and technical challengesAligning product development with customer expectationsLeading technical engagement plans with strategic customers and partnersSupporting collaboration with external research institutionsCommunicating technology roadmaps across internal and external stakeholdersDriving cross-divisional projects involving engineering and business leadersPartnering with sales teams to understand future customer needsEnsuring strong communication between innovation and R&D teamsThe Successful ApplicantA Master's degree in Engineering or Science; PhD preferred10+ years of experience in advanced packaging and integration engineeringDeep knowledge of packaging architecture and process flowsStrong project management and cross-functional leadership skillsExcellent communication and presentation abilitiesExperience in developing technical literature and engaging with customersWhat's on OfferHigh-impact role with visibility across global teamsOpportunity to shape the future of semiconductor packagingCollaborative and innovation-driven work environmentCompetitive compensation and career advancementContactEddie ChienQuote job refJN-102025-6861598Phone number+886 2 8729 8260Job summaryJob functionEngineering & ManufacturingSpecialisationEngineering Design, R&D and NPIWhat is your area of specialisation?SemiconductorsLocationHsinchu CityContract TypePermanentConsultant nameEddie ChienConsultant phone+886 2 8729 8260Job ReferenceJN-102025-6861598