Application Engineer- Packaging Industry

Taipei Permanent
  • Multinational Company with Wide Diversity of Business Contacts
  • The World's Top Ranking Semiconductor and Electronic Vendor

About Our Client

Our Client is a leading Electronic Design Automation Software MNC based in the US, merged with Europe¡¦s largest Industrial Manufacturing Company.

Job Description

    • Secure Technical Design Wins for Product and Service, specifically with Xpedition Substrate Integrator (XSI) and Xpedition Package Designer (XPD), the industry leading product families.
  • Support Consultative Sales
  • Deliver Technical Presentations
  • Conduct Product Demonstrations and Benchmarks
  • Develop and Lead Strategies to Gain Market Share
  • Territory spreads beyond Taiwan, Korea, Japan, China, and over the Pac-Rim
  • Integrate with Peers beyond Pac-Rim, from over the globe, communicate essential status to a variety of Stakeholders.
  • International Travels

The Successful Applicant

  • Familiar with IC Packaging Design Processes, focus on High Speed Verification
  • Experience in Packaging and/or PCB Design, Layout, Fabrication, and Verification
  • Two Years of Experience in System Design (plus)
  • Hands-on Experience with Schematic Design, Board Layout and Signal Integrity Tools, Mixed Signal, or RF Circuit Cards (plus)
  • Adequate English Proficiency
  • Preferred: additional experience with Signal Integrity Analysis and/or Valor
    • Preferred Experience: Management, Mentor¡¦s Xpedition flow, Cadence Allegro/APD/SiP/Orbit IO or Zuken CR-5000/8000

What's on Offer

Flexible Time-Off, Insurance, Tuition and Educational Aids, and other various Benefits

Prestigious Foreign Based Company

Contact
April Lo
Quote job ref
4173695
Phone number
+886 2 8729 8266

Job summary

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Location
Contract Type
Consultant name
April Lo
Consultant phone
+886 2 8729 8266
Job Reference
4173695