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Product Engineer- Wafer Grinding
- Global Materials Company
- Excellent Salary Package and Benefits
About Our Client
A multinational company and top 100 industrial corporate in the world with operations in 64 countries and headquarter in Paris.
- Provide abrasives technical service to customer and get the qualification for existing products
To liaise with customer to understand their demands then work with global product team on optimise solutions to meet customer requirements.
- Conduct a successful test and feedback with a detailed report & data analysis.
The Successful Applicant
- Familiar with semiconductor back-end Grinding process
- Experienced in wafer backside grinding/or saw application
- Excellent communication skills
- Fluent in English
What's on Offer
Excellent salary and employee benefits